Elektronische Teile : M368L3324BUM-CB3

Hersteller : SAMSUNG[Samsung semiconductor]

Verpackung :

Pins :

Beschreibung : SDRAM Unbuffered Module 184pin Unbuffered Module based 512Mb B-die with 64/72-bit ECC/ECC TSOP-II

Temperatur : Min °C | Max °C

Datasheet : M368L3324BUM-CB3 PDF

• M368L3324BUM-CB3
• M368L3324BUM-CCC
• M368L3324BUM-LB3
• M368L3324BUM-LCC